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CVE-2023-52784 is an improper network-device lifecycle handling flaw in the Linux kernel bonding subsystem. A bonding device can have a LAPB-over-Ethernet dependent device attached while the bond has no members. Enslaving a non-Ethernet interface can subsequently change the bonding master device type. Before the fix, bond_setup_by_slave() did not close the bonding device before this transition, leaving dependent devices with assumptions about the prior physical-device type. Subsequent network-device event handling and transmission can construct an invalid packet header and trigger an skb underflow assertion.
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Improper device-state handling in Linux kernel bonding setup.
Linux kernel bonding-driver vulnerability addressed by stopping the device in bond_setup_by_slave().
Linux kernel bonding driver flaw related to device handling in bond_setup_by_slave().
Unknown.
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Every observed campaign linking this CVE to a named adversary.
Malware families riding this exploit, with evidence and IOCs.
YARA, Sigma, Snort, and vendor rules, auto-deployed to your SIEM.
Cross-references every affected SKU, including bundled OEM variants.
Community discussion across Reddit, Mastodon, and other social sources.